Enabling Next-Generation Gallium Oxide High-Voltage Electronics

Delivering step changes for future grid and renewables applications

Background and Technology Overview

The move to greater efficiencies in power conversion will be leveraged by cutting-edge material physics. With a bandgap of approximately 4.8 eV has the potential to far outperform SiC and GaN and offer devices that can operate at higher voltages, temperatures, and power densities.

REWIRE is setting new benchmarks for this technology, recent achievements include the demonstration of vertical Schottky diode devices with breakdown voltages exceeding 4 kV—the first of their kind.

REWIRE is focused on unlocking the potential of Ga2O3 for high-voltage applications by addressing critical technical barriers to commercial adoption, paving the way for next-generation power electronics.

gallium oxide material performance comparison

Currently at Technology Readiness Level (TRL) 3, the initiative focuses on refining device performance through process enhancements, including dielectric and etching improvements, aiming to boost manufacturability and scalability.

Opportunities

Enhance device packaging and integration tailored for high-voltage operation

Collaborate on scaling manufacturing processes to meet volume production requirements

Co-develop device testing and reliability validation protocols

Explore commercial pathways and joint development opportunities

Benefits

Applications

Unlocked potential of gallium oxide devices

Pushing the capabilities of next-generation technologies

Next-generation device design

Translatable innovations that can be expanded to other material systems

New system-level capabilities

Enabled by kV-rated device components

Springboard for future innovation

Streamlining development for other ultrawide bandgap semiconductors

Renewables

Defence

Industrial

Transport

Partners sought

Partnership models available

Power electronics manufacturers

Equipment manufacturers

Automotive OEMs

Power supply and energy infrastructure

Material and wafer suppliers

End users

Collaborative R&D

Contract research

Studentships

Facility access and prototyping support